Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications

Light Emitting Diode (LED) applications are increasingly used in various microelectronic devices due to their efficient light generation. The miniaturisation of the LED and its integration into compact within weight limit have resulted excessive heat generation, inefficient management this could lead failure entire system. Passive and/or active sinks for dissipating from system environment improve performance. An ANSYS design modeller transient thermal conditions were utilised study simulate performs function by utilising Finite Element Method (FEM) technique. considered work consists a chip, interface material, cylindrical sink. thickness Cylindrical Heat Sink (CHS) fins investigation is between 2 mm 6 mm, whilst ensuring mass not more than 100 g. input power chip 4.55 W 25.75 W, as required some original equipment manufacturers (OEMs). A mesh dependency was carried out ensure results synonymous with what can be obtained practically. simulation suggest that ratings did affect resistance CHS. In addition, increased CHS fin. efficiencies sink found increase an fin accuracy calculated simulated efficiency ranges 84.33% 98.80%. Evidently, other fins, depicted study.